Biography
Enrollment Date: 2011
Graduation Date：2015
Degree：M.S.
Defense Date：2015.06.03
Advisors：Liji Wu
Department：Institute of Microelectronics，Tsinghua University
Title of Dissertation/Thesis：Design and Implementation of Mixed-signal SoC Based on Tire Pressure Monitoring System
Abstract:
Contents of this paper are the design and implementation of SoC in the TPMS. The TPMS is designed by the recommended standard from "Automotive Tire Pressure Monitoring System Based on Tire Pressure Monitoring Module ", national implementation of GB/T 26149-2010 on July 2011. This standard requires the pressure measurement range up to 100~700kPa, with tolerances of pressure measurement error less than ±12kPa when temperatures between -20~70°C and pressure measurement error less than ±21kPa when temperature between -40~125°C (beyond -20~70°C). The operating temperature is between -40~105°C, and the storage temperature is between -40~125°C. This paper completes the design and implementation of mixed-signal SoC for TPMS module, which includes power management, MEMS pressure sensor intereface, CMOS temperature sensor, 125kHz low frequency wake-up, MCU, EEPROM, clock generation and test modules, a total of eight main modules. This paper completes the defense of mixed-signal SoC system, layout design, post-simulation, and chip test. Accounding to the test results, the SoC can be wakeup between 100~150kHz. The output of power management is 2.5V. The SoC can work between -40~125°C.In this paper, the design and implementation of TPMS mixed-signal SoC temperature sensor module have been fulfilled. The design adopts the linear characteristics between ΔV_BE and temperature that achieves the temperature detection at -50~150°C. The resolution is up to 0.19°C/LSB and the error range at ±9.5°C, which meets the standards for error under ±10°C and 0.3°C/LSB for automotive electronics tire pressure monitoring temperature sensors. Accounding to the test results, the temperature sensor works well.The SoC design uses the 0.35μm 40V BCD Embedded EEPROM Modular Process from ASMC.