Title：A TSV through-hole data transmission circuit with low power consumption and low power jitter based on frequency division
Country：China
Patent No.：202111333647.2
Legal Status：Under review
Inventor：Fule Li, Zhe Zhou
Assignee：Tsinghua University
Address：Tsinghua University,Haidian District Beijing 100084, China
Filing Date：2021-11-11
Issue Date：
Abstract：
Patent Certificate：
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