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【Research project】
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37 International Ongoing Projects are found in “Integrated Circuits and Systems Group of Tsinghua University (Sub-Group in Institute of Microelectronice)”
Search “37 International Collaboration Programs are found.
Project Name Project Source Project Source No. Start Time End Time
Hearing aid device results transformation Cooperation Programs 2019.1 2024.1
Wisers and Tsinghua University's Institute of Microelectronics collaborate to develop "UW Jutian EDA-based IC layout design experimental platform" Cooperation Programs 2021.4 2022.12
High-precision brain-computer interface chip design Cooperation Programs 2021.5 2023.9
Ultra-low power ECG signal processing circuit Cooperation Programs 2021.8 2023.6
IQ modulation technology research Cooperation Programs 2021.8 2023.12
Complex pulse electric field tumor ablation and tumor electric field therapy technology Cooperation Programs 2021.8 2023.12
24-bit ultra-low power analog chip simulation, flow and test Cooperation Programs 2021.10 2022.7
Millimeter wave active subarray key unit design flow Cooperation Programs 2022.11
Code division HBF study Cooperation Programs 2022.12
Key technology research on multi-beam millimeter wave phased array front-end chip National Foundation Committee 62074090 2021.1 2024.12
Ultra-high-speed millimeter wave base station back propagation prototype and demonstration system Ministry of science and technology 2019YFB2204704 2020.1 2023.12
Key technology research on million-degree neuron-like brain computing chip based on asynchronous communication architecture National Natural Science Foundation of China U20A20220 2021.1 2024.12
2019 Youth Thousand Program Projects - (14 batches) Thousands of people in the Ministry of Organization 2020.1 2022.12
14-bit 4GS/s analog-to-digital conversion chip development and demonstration application Beijing Z201100004320003 2020.2 2022.4
2020 Youth Thousand Project-Lot 15-Key Technology of Silicon-based Millimeter Wave MIMO 3D Imaging Radar Chip Thousands of people in the Ministry of Organization 2020.1 2023.1
Key Technologies of Digital Silicon-Based THz Transceiver Chips National Natural Science Foundation of China 62131013 2022.1 2026.12
6G high-density RF front-end technology National key research and development program 2020YFB1807402 2020.12 2023.11
6G high-density RF front-end technology National key research and development program 2020YFB1807301 2020.12 2024.12
Research on chip design technology based on module chip Shenzhen basic research program JCYJ20200109143003935 2020.11 2023.11
Research on millimeter wave reconfigurable technology and key technology of new 5G millimeter wave dual frequency transceiver chip Shenzhen basic research program JCYJ20200109113601723 2020.11 2023.11