Project Name |
Project Source |
Project Source No. |
Start Time |
End Time |
Hearing aid device results transformation |
Cooperation Programs |
|
2019.1 |
2024.1 |
Wisers and Tsinghua University's Institute of Microelectronics collaborate to develop "UW Jutian EDA-based IC layout design experimental platform" |
Cooperation Programs |
|
2021.4 |
2022.12 |
High-precision brain-computer interface chip design |
Cooperation Programs |
|
2021.5 |
2023.9 |
Ultra-low power ECG signal processing circuit |
Cooperation Programs |
|
2021.8 |
2023.6 |
IQ modulation technology research |
Cooperation Programs |
|
2021.8 |
2023.12 |
Complex pulse electric field tumor ablation and tumor electric field therapy technology |
Cooperation Programs |
|
2021.8 |
2023.12 |
24-bit ultra-low power analog chip simulation, flow and test |
Cooperation Programs |
|
2021.10 |
2022.7 |
Millimeter wave active subarray key unit design flow |
Cooperation Programs |
|
|
2022.11 |
Code division HBF study |
Cooperation Programs |
|
|
2022.12 |
Key technology research on multi-beam millimeter wave phased array front-end chip |
National Foundation Committee |
62074090 |
2021.1 |
2024.12 |
Ultra-high-speed millimeter wave base station back propagation prototype and demonstration system |
Ministry of science and technology |
2019YFB2204704 |
2020.1 |
2023.12 |
Key technology research on million-degree neuron-like brain computing chip based on asynchronous communication architecture |
National Natural Science Foundation of China |
U20A20220 |
2021.1 |
2024.12 |
2019 Youth Thousand Program Projects - (14 batches) |
Thousands of people in the Ministry of Organization |
|
2020.1 |
2022.12 |
14-bit 4GS/s analog-to-digital conversion chip development and demonstration application |
Beijing |
Z201100004320003 |
2020.2 |
2022.4 |
2020 Youth Thousand Project-Lot 15-Key Technology of Silicon-based Millimeter Wave MIMO 3D Imaging Radar Chip |
Thousands of people in the Ministry of Organization |
|
2020.1 |
2023.1 |
Key Technologies of Digital Silicon-Based THz Transceiver Chips |
National Natural Science Foundation of China |
62131013 |
2022.1 |
2026.12 |
6G high-density RF front-end technology |
National key research and development program |
2020YFB1807402 |
2020.12 |
2023.11 |
6G high-density RF front-end technology |
National key research and development program |
2020YFB1807301 |
2020.12 |
2024.12 |
Research on chip design technology based on module chip |
Shenzhen basic research program |
JCYJ20200109143003935 |
2020.11 |
2023.11 |
Research on millimeter wave reconfigurable technology and key technology of new 5G millimeter wave dual frequency transceiver chip |
Shenzhen basic research program |
JCYJ20200109113601723 |
2020.11 |
2023.11 |